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The Mapper FLX series revolutionises the use of e-beam lithography: on the one hand it is a perfect companion for researching device characteristics, prototyping new applications and doing specialized low volume applications. On the other hand it is a scalable manufacturing method, an enabler to step up to volume production. Producing thousands of wafers per month with fully customized e-beam layers, in mix-and-match operation with optical lithography, is now a viable solution.

The systems are developed in the highly respected industrial base for precision technology of the Netherlands and Western Europe. Mapper combines the most advanced precision mechanics, electronics, optics and embedded software into a high performance lithography system. The industrialisation of Mapper’s technology has been developed in close cooperation with TSMC and CEA-LETI.

The high throughput is achieved by the integration of 65,000 parallel electron beamlets. The electron optics have no central crossovers making them intrinsically insensitive to Coulomb forces (electron repulsion), which have always been the “Achilles Heel” for the adoption of electron beam technology beyond the use in R&D environments. High-resolution lithography without a mask on 200 mm and 300 mm wafers with mix-and-match capability enables a wide range of new applications. This opens the door to extend product roadmaps beyond the capabilities of existing optical and e-beam lithography solutions.

customer benefits

From day one the Mapper system is designed to be compatible with existing lithography. The resist scheme is identical to optical DUV stacks. Optical alignment sensors can register all commonly used overlay targets. With integrated magnetic shielding the system can be installed right next to steppers and scanners. Support systems can be placed in a sub-fab or in an adjacent room and don’t occupy costly cleanroom space. The wafer stage features an absolute grid accuracy that is in the nanometer range. The pattern streaming supercomputer effortlessly matches other tools’ wafer grids with higher order corrections per field, on the fly applied at three terapixels per second. Dose can be matched with real-time dithering. Flexibility is key.

The FLX is Mapper’s 3rd generation platform. The first models come with 65,000 beamlets. A huge step up from the 110 beamlets in the previous generation, and even that number is still unmatched. The FLX is designed with the future in mind: it supports extendibility paths in resolution, overlay, throughput and substrate types. The column design extends to 650,000 beamlets. Its footprint and service access are prepared for clustering, so that 40 wafers per hour or more from an e-beam litho-cell is a reality not too far away.

key features

  • Electron source delivering >100 mA of current, operated at 5 kV
  • Massively parallel electron optics
  • Nanometer accuracy wafer stage under interferometer control
  • Availability of both 300 mm and 200 mm platform
  • No dedicated electro-magnetic environment is required
  • Data format is an open source OASIS.MAPPER format based on the OASIS standard
  • Mix-and-match capability with optical lithography and other electron beam machines
  • Modular design to provide flexible production capacity
  • The system complies with the required standards and directives (such as SEMI standards and other machine directives)